Industrial Ethernet has been on the market for nearly 20 years and is the communication technology of choice in industrial automation. However, with the standardization of Time Sensitive Networking (TSN) and Industry 4.0 driving the convergence of IT and OT networks, we are at the crossroads of how the Industrial Ethernet protocol fits into these new technologies driving change.

Recommend two products about building automation system

ADIN1200CCP32Z-R7 ADI 9800pcs D/C 21+ QFN32
ADIN1300BCPZ-R7 ADI 3000pcs D/C 22+ LFCSP-40

The chip integrates an energy-efficient Ethernet (EEE) physical layer device (PHY) core and associated general-purpose analog circuitry, input and output clock buffers, management interface and subsystem registers, and media access control (MAC) interface and control logic to manage Reset, clock control, and pin configuration.


ADIN1200 can support up to 180 meters of cable.
The ADIN1300 supports 150 meters of cable at gigabit speeds and 180 meters of cable when operating at 100 Mbps or 10 Mbps.
ADIN1200 does not support SGMII interface. Supports MII, RMII, and RGMII MAC interface modes.

 
The LFCSP has an exposed pad under the package, which must be soldered to the PCB ground for electrical, mechanical and thermal reasons. For thermal resistance performance and maximum heat dissipation, a 4 × 4 array of thermal vias under the exposed ground pad is recommended.

There are also two bus bars on either side of the exposed pad that connect to internal voltage rails and are not intended and should not be soldered to the board. The PCB land pattern must contain an exposed ground pad with vias and two keep-out areas around bus bars in the package. No PCB traces or vias can be used in any of the keep-out areas. The EVAL-ADIN1300FMCZ uses a 4 × 4 via array on a 0.75 mm grid arrangement, as shown in the figure below. The through-hole pad diameter dimension is 0.02" (0.5015mm), and the finished drilled hole diameter is 0.01" (0.2489mm). This also applies to the exposed pad and bus bars of the ADIN1200. See the ADIN1200 data sheet for equivalent data for different package sizes.